International SIG

The International Special Interest Group (SIG) is a forum for RESNA members and others who are interested and/or active in providing services or conducting research relative to Assistive Technology in developing countries and other resource limited environments. Through participation in this forum and establishing networks, individual members benefit from the shared experiences of other International SIG members.

New for 2013

International SIG announces Student Design Competition Cash Prize

RESNA's International Special Interest Group (SIG) is offering a $500 cash prize to the 2013 Student Design Competition entry deemed "Technology Most Likely to Close the Gap in Developing Countries." 

In order to be considered for the award, entries must be designed to benefit people with disabilities in developing countries. The criteria for judging includes:

• Level of innovation
• Number of potential beneficiaries
• Ability to be replicated and/or scaled up
• Potential to go to market
• Ease of being adopted or adapted to the local level 

Student teams must register their intent to submit by April 19, 2013. The final submission deadline is April 26, 2013.

For submission information, please click here.

Travel grant for the Disability, Rehabilitation & Technology 2013 Symposium

RESNA's International SIG is pleased to announce that members and non-members may seek funds to support their travel to attend the Disability, Rehabilitation and Technology in Low to Middle Income Countries Symposium in June 2013. 

The application deadline is May 10, 2013. Click here for more information on what to submit.

Travel grant for on-going projects in participating countries

Applicants (RESNA members and non-members) may seek funds to support their travel, such as airfare and accommodations, to get involved and support an on-going project related to assistive technology in a developing country. 

Applications are accepted on an ad hoc basis during the 2013 calendar year. Please allow 6-8 weeks for application review. Click here for more information on what to submit.